The United States expects to direct up to $1.6 billion in funding to boost semiconductor packaging, the Commerce Department said Friday, as Washington
The United States expects to direct up to $1.6 billion in funding to boost semiconductor packaging, the Commerce Department said Friday, as Washington seeks to stay ahead in tech while competition with China intensifies. The funding comes under the CHIPS and Science Act, a package of incentives to boost research and US semiconductor production. “Securing […]
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https://insiderpaper.com/us-plans-up-to-1-6-bn-towards-chip-packaging-tech/
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